BUK136-50L Datasheet, PDF (6/7 Pages) NXP Semiconductors – Logic level TOPFET SMD version of BUK125-50L

Philips Semiconductors
Logic level TOPFET
SMD version of BUK125-50L
MECHANICAL DATA
Plastic single-ended surface mounted package (Philips version of D²-PAK); 5 leads
(one lead cropped)
Product specification
BUK136-50L
SOT426
E
D1
D
HD
3
1
24
5
b
eeee
A
A1
mounting
base
Lp
c
Q
0
2.5 5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A1
b
c
D
max.
D1
E
e
Lp
HD
Q
mm ^{4.50 1.40 0.85 0.64}
4.10 1.27 0.60 0.46
11
1.60
1.20
10.30
9.70
1.70
2.90 15.80 2.60
2.10 14.80 2.20
OUTLINE
VERSION
IEC
SOT426
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
98-12-14
99-06-25
Fig.4. SOT426 surface mounting package¹, centre pin connected to mounting base.
1 Epoxy meets UL94 V0 at 1/8". Net mass: 1.5 g.
For soldering guidelines and SMD footprint design, please refer to Data Handbook SC18.
July 2002
6
Rev 1.000