BTA208X-1000B Datasheet, PDF (6/13 Pages) NXP Semiconductors – Three quadrant triacs high commutation

NXP Semiconductors
BTA208X-1000B
3Q Hi-Com Triac
8. Thermal characteristics
Table 5.
Symbol
R_th(j-h)
Thermal characteristics
Parameter
thermal resistance
from junction to
heatsink
R_th(j-a)
thermal resistance
from junction to
ambient
Conditions
full cycle or half cycle; with heatsink
compound; Fig. 6
full cycle or half cycle; without heatsink
compound; Fig. 6
in free air
10
Z_th(j-h)
(K/W)
1
(1)
(2)
(3)
(4)
Min Typ Max Unit
-
-
4.5 K/W
-
-
6.5 K/W
-
55
-
K/W
003aaf915
10^{- 1}
P
10^{- 2}
10^{- 3}
10^{- 5}
10^{- 4}
10^{- 3}
10^{- 2}
10^{- 1}
(1) Unidirectional (half cycle) without heatsink compound
(2) Unidirectional (half cycle) with heatsink compound
(3) Bidirectional (full cycle) without heatsink compound
(4) Bidirectional (full cycle) with heatsink compound
t_p
t
1
10
t_p (s)
Fig. 6. Transient thermal impedance from junction to heatsink as a function of pulse duration
9. Isolation characteristics
Table 6. Isolation characteristics
Symbol
Parameter
Conditions
V_isol(RMS)
RMS isolation voltage
from all terminals to external heatsink;
sinusoidal waveform; clean and dust
free; 50 Hz ≤ f ≤ 60 Hz; RH ≤ 65 %;
T_h = 25 °C
C_isol
isolation capacitance from main terminal 2 to external
heatsink; f = 1 MHz; T_h = 25 °C
Min Typ Max Unit
-
-
2500 V
-
10
-
pF
BTA208X-1000B
Product data sheet
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22 May 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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