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BUK7237-55A Datasheet, PDF (5/13 Pages) NXP Semiconductors – TrenchMOS standard level FET | |||
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Philips Semiconductors
BUK7237-55A
TrenchMOS⢠standard level FET
8. Characteristics
Table 5: Characteristics
Tj = 25 °C unless otherwise speciï¬ed
Symbol Parameter
Static characteristics
V(BR)DSS
drain-source breakdown
voltage
VGS(th)
gate-source threshold voltage
IDSS
drain-source leakage current
IGSS
RDSon
gate-source leakage current
drain-source on-state
resistance
Dynamic characteristics
Ciss
input capacitance
Coss
output capacitance
Crss
reverse transfer capacitance
td(on)
turn-on delay time
tr
rise time
td(off)
turn-off delay time
tf
fall time
Ld
internal drain inductance
Ls
internal source inductance
Conditions
ID = 0.25 mA; VGS = 0 V
Tj = 25 °C
Tj = â55 °C
ID = 1 mA; VDS = VGS;
Figure 9
Tj = 25 °C
Tj = 175 °C
Tj = â55 °C
VDS = 55 V; VGS = 0 V
Tj = 25 °C
Tj = 175 °C
VGS = ±20 V; VDS = 0 V
VGS = 10 V; ID = 25 A;
Figure 7 and 8
Tj = 25 °C
Tj = 175 °C
VGS = 0 V; VDS = 25 V;
f = 1 MHz; Figure 12
VDD = 30 V; RL = 1.2 â¦;
VGS = 10 V; RG = 10 â¦;
from drain lead from package to
centre of die
from source lead to source bond
pad
Min
Typ
Max Unit
55
â
â
V
50
â
â
V
2
3
4
V
1
â
â
V
â
â
4.4
V
â
0.05 10
µA
â
â
500
µA
â
2
100
nA
â
31
37
mâ¦
â
â
74
mâ¦
â
650
872
pF
â
170
205
pF
â
110
153
pF
â
10
â
ns
â
62
â
ns
â
24
â
ns
â
20
â
ns
â
2.5
â
nH
â
7.5
â
nH
9397 750 07677
Product speciï¬cation
Rev. 01 â 29 January 2001
© Philips Electronics N.V. 2001. All rights reserved.
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