BTA208X-1000C Datasheet, PDF (5/12 Pages) NXP Semiconductors – Three quadrant triacs high commutation

Philips Semiconductors
5. Thermal characteristics
Table 4:
Symbol
R_th(j-h)
R_th(j-a)
Thermal characteristics
Parameter
Conditions
thermal resistance from junction to see Figure 6
heatsink
see Figure 6
thermal resistance from junction to in free air
ambient
[1] Full or half cycle; with heatsink compound.
[2] Full or half cycle; without heatsink compound.
BTA208X-1000C
Three quadrant triacs high commutation
Min
Typ
Max
Unit
[1] _-
-
4.5
K/W
[2] _-
-
6.5
K/W
-
55
-
K/W
10
Z_th(j-h)
(K/W)
1
(1)
(2)
(3)
(4)
003aaa972
10^−1
P_D
10^−2
10^−5
10^−4
10^−3
10^−2
10^−1
1
(1) Unidirectional without heatsink compound
(2) Unidirectional with heatsink compound
(3) Bidirectional without heatsink compound
(4) Bidirectional with heatsink compound
Fig 6. Transient thermal impedance from junction to heatsink as a function of pulse width
t_p
t_p (s)
t
10
6. Isolation characteristics
Table 5: Isolation limiting values and characteristics
T_h = 25 °C unless otherwise specified
Symbol Parameter
Conditions
V_isol(rms)
RMS isolation voltage
f = 50 Hz to 60 Hz; sinusoidal
waveform; RH ≤ 65 %; clean and dust
free; from all three terminals to
external heatsink
C_isol
isolation capacitance
f = 1 MHz; from pin 2 to external
heatsink
Min Typ Max Unit
-
-
2500 V
-
10 -
pF
BTA208X-1000C_1
Product data sheet
Rev. 01 — 4 October 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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