74F3893 Datasheet, PDF (5/10 Pages) NXP Semiconductors – Quad futurebus backplane transceiver

Philips Semiconductors
Quad Futurebus backplane transceiver
Product specification
74F3893
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST
CONDITIONS¹
LIMITS
UNIT
MIN TYP² MAX
I_OH
V_OH
V_OHB
V_OL
V_OLB
V_OCB
High–level output current
High-level output voltage
High-level output bus voltage
Low-level output voltage
Low-level output
bus voltage
Driver output positive
clamp voltage
I/On
V_CC = MAX, V_IL = MAX, V_IH = MIN, V_OH = 1.5V
10 100 µA
Rn
V_CC = MAX, V_IL = 1.3V, RE = 0.8V, I_OH = MAX
2.5
V
I/On
V_CC = MAX, Dn = DE = 0.8V, V_T = 2.0V,
R_T = 10Ω, RE = 2.0V
2.5
V
Rn
V_CC = MIN, V_IN = 1.8V, RE = 0.8V, I_OL = 6mA
0.35 0.5 V
I/On
Dn = DE = V_IH, I_OL = 100mA
0.75 1.0 1.2 V
Dn = DE = V_IH, I_OL = 80mA
0.75 1.0 1.1 V
I/On
V_CC = MAX or 0V,
I/On = 1mA 1.9
2.9 V
Dn = DE = 0.8V, RE = 2.0V
I/On = 10mA 2.3
3.2 V
V_IK
Input clamp voltage
V_CC = MIN, I_I =I_IK
–0.73 -1.2 V
I_I
Input current at maximum input voltage
V_CC = MAX, V_I = 7.0V, DE = RE = Dn = V_CC
100 µA
I_IH
High–level input current
Dn, RE, DE V_CC = MAX, DE = RE = Dn =5.5V
20 µA
I_IHB
High–level I/O bus current
(power off)
I/On
V_CC = 0V, Dn = DE = 0.8V, I/On =1.2V, RE = 0V
100 µA
I_IL
Low–level input current
Dn, RE V_CC = MAX, V_I = 0.5V, DE = 4.5V
DE
V_CC = MAX, V_I = 0.5V, Dn = 4.5V
I_ILB
Low–level I/O bus current
(power on)
I/On
V_CC = MAX, Dn = DE = 0.8V, I/On =0.75V,
RE = 0V
–20
–40 µA
–200 µA
20 µA
I_OZH
Off–state output current,
high–level voltage applied
Rn
V_CC = MAX, V_I = 2.7V, RE = 2V
20 ^µA
I_OZL
Off–state output current,
low–level voltage applied
V_CC = MAX, V_I = 0.5V, RE = 2V
–20 ^µA
I_OS
Short circuit output current³
I_CC
Supply current⁴ (total)
Rn
V_CC = MAX
’F8
V_CC = MAX, (RE = V_IH or V_IL)
-60
-150 mA
55 80 mA
Notes to DC electrical characteristics
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V_CC = 5V, T_amb = 25°C.
3. Not more than one output should be shorted at a time. For testing I_OS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a high output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I_OS tests should be performed last.
January 18, 1991
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