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PZ1418B30U Datasheet, PDF (4/16 Pages) NXP Semiconductors – NPN microwave power transistors
Philips Semiconductors
NPN microwave power transistors
Product specification
PZ1418B30U; PZ1721B25U;
PZ2024B20U
THERMAL CHARACTERISTICS
SYMBOL
PARAMETER
CONDITIONS
Rth j-mb
Rth mb-h
thermal resistance from junction to mounting-base Tj = 75 °C
thermal resistance from mounting-base to heatsink Tj = 75 °C; note 1
Note
1. See “Mounting recommendations in the General part of handbook SC15”.
MAX.
2.2
0.2
UNIT
K/W
K/W
CHARACTERISTICS
Tmb = 25 °C unless otherwise specified.
SYMBOL
PARAMETER
ICBO
collector cut-off current
ICES
collector cut-off current
IEBO
emitter cut-off current
CONDITIONS
VCB = 40 V; IE = 0
VCB = 30 V; IE = 0
VCE = 35 V; RBE = 0
VEB = 1.5 V; IC = 0
MAX.
10
5
50
200
UNIT
mA
mA
mA
µA
APPLICATION INFORMATION
PZ1418B30U
Microwave performance up to Tmb = 25 °C in a common base class B wideband amplifier.
TYPE
f
VCC
NUMBER
(GHz)
(V)
PZ1418B30U
1.4 to 1.8
28
PL
(W)
≥27
typ. 35
Gp
(dB)
≥7.3
typ. 8.4
ηC
(%)
≥38
typ. 45
Zi; ZL
(Ω)
see Figs 6 and 7
handbook, full pagewidth
24
5
5 2 5.5 2
,,,,, ,,,,,,,,,, input
,,,,,,,,,, ,,,,,,,,,,,,,,,, 50Ω
0.65
6.5
12 21 4
0.65
100 pF
(ATC)
8.5
output
50 Ω
MGK064
Dimensions in mm.
Substrate: Epsilam printed-circuit board.
Thickness: 0.635 mm.
Permittivity: εr = 10.
Fig.3 Wideband test circuit board for 1.4 to 1.8 GHz operation (PZ1418B30U).
1997 Feb 19
4