BUK113-50DL Datasheet, PDF (4/6 Pages) NXP Semiconductors – PowerMOS transistor Logic level TOPFET

Philips Semiconductors
PowerMOS transistor
Logic level TOPFET
Objective specification
BUK113-50DL
MOUNTING INSTRUCTIONS
Dimensions in mm.
3.8
min
1.5
min
1.5
min
(3x)
1.5
min
2.3
6.3
PRINTED CIRCUIT BOARD
Dimensions in mm.
36
60
4.6
9
10
18
4.5
4.6
Fig.2. Soldering pattern for surface mounting.
7
15
50
Fig.3. PCB for thermal resistance and power rating.
PCB: FR4 epoxy glass (1.6 mm thick),
copper laminate (35 µm thick).
January 1996
4
Rev 1.000