BC857XMB_15 Datasheet, PDF (4/14 Pages) NXP Semiconductors – 45 V, 100 mA PNP general-purpose transistors

NXP Semiconductors
BC857xMB series
45 V, 100 mA PNP general-purpose transistors
6. Thermal characteristics
Table 7.
Symbol
R_th(j-a)
Thermal characteristics
Parameter
thermal resistance from
junction to ambient
Conditions
in free air
Min
[1][2] _-
Typ Max
-
500
[1] Device mounted on an FR4 PCB, single-sided copper, tin-plated and standard footprint.
[2] Reflow soldering is the only recommended soldering method.
Unit
K/W
10³
Z_th(j-a)
(K/W)
10²
10
duty cycle =
1
0.75
0.5
0.33
0.2
0.1
0.05
0.02
0.01
0
006aab603
1
10^−5
10^−4
10^−3
10^−2
10^−1
1
10
10²
10³
t_p (s)
FR4 PCB, standard footprint
Fig 2. Transient thermal impedance from junction to ambient as a function of pulse duration; typical values
BC857XMB_SER
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 21 February 2012
© NXP B.V. 2012. All rights reserved.
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