74F385 Datasheet, PDF (4/6 Pages) NXP Semiconductors – Quad serial adder/subtractor

Philips Semiconductors
Quad serial adder/subtractor
Product specification
74F385
ABSOLUTE MAXIMUM RATINGS
(Operation beyond the limit set forth in this table may impair the useful life of the device. Unless otherwise noted these limits are over the
operating free-air temperature range.)
SYMBOL
PARAMETER
RATING
UNIT
V_CC
V_IN
I_IN
V_OUT
Supply voltage
Input voltage
Input current
Voltage applied to output in High output state
–0.5 to +7.0
V
–0.5 to +7.0
V
–30 to +5
mA
–0.5 to V_CC
V
I_OUT
Current applied to output in Low output state
40
mA
T_amb
T_stg
Operating free-air temperature range
Storage temperature
0 to +70
°C
–65 to +150
°C
RECOMMENDED OPERATING CONDITIONS
SYMBOL
PARMETER
V_CC
V_IH
V_IL
I_IK
I_OH
I_OL
T_amb
Supply voltage
High-level input voltage
Low-level input voltage
Input clamp current
High-level output current
Low-level output current
Operating free-air temperature range
LIMITS
UNIT
MIN
NOM
MAX
4.5
5.0
5.5
V
2.0
V
0.8
V
–18
mA
–1
mA
20
mA
0
70
°C
DC ELECTRICAL CHARACTERISTICS
(Over recommended operating free-air temperature range unless otherwise noted.)
SYMBOL
PARAMETER
TEST
CONDITIONS¹
LIMITS
UNIT
MIN TYP² MAX
V_OH
High-level output voltage
V_CC = MIN, V_IL = MAX,
±10%V_{CC 2.5}
V
V_IH = MIN, I_OH = MAX
±5%V_{CC 2.7 3.4}
V
V_OL
Low-level output voltage
V_IK
Input clamp voltage
I_I
Input current at maximum input voltage
I_IH
High-level input current
I_IL
Low-level input current
I_OS
Short-circuit output current³
V_CC = MIN, V_IL = MAX,
V_IH = MIN, I_OL = MAX
V_CC = MIN, I_I = I_IK
V_CC = MAX, V_I = 7.0V
V_CC = MAX, V_I = 2.7V
V_CC = MAX, V_I = 0.5V
V_CC = MAX
±10%V_CC
±5%V_CC
0.35 0.50 V
0.35 0.50 V
–0.73 –1.2 V
100 µA
20 µA
–20 µA
–60
–150 mA
I_CC
Supply current (total)
V_CC = MAX
55 80 mA
Notes:
1. For conditions shown as MIN or MAX, use the appropriate value specified under recommended operating conditions for the applicable type.
2. All typical values are at V_CC = 5V, T_amb = 25°C.
3. Not more than one output should be shorted at a time. For testing I_OS, the use of high-speed test apparatus and/or sample-and-hold
techniques are preferable in order to minimize internal heating and more accurately reflect operational values. Otherwise, prolonged shorting
of a High output may raise the chip temperature well above normal and thereby cause invalid readings in other parameter tests. In any
sequence of parameter tests, I_OS tests should be performed last.
1989 Sep 20
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