TDA6500 Datasheet, PDF (37/37 Pages) NXP Semiconductors – 5 V mixer/oscillator and synthesizer for PAL and NTSC standards

Philips Semiconductors
TDA6500; TDA6501
5 V mixer/oscillator and synthesizer for PAL and NTSC standards
22. Contents
1
2
3
4
5
6
6.1
6.2
7
7.1
7.2
7.2.1
7.2.2
7.2.3
8
9
10
11
12
12.1
12.2
12.3
12.3.1
12.3.2
13
13.1
13.2
13.3
14
15
15.1
15.2
15.3
15.4
15.5
16
17
18
19
20
21
General description . . . . . . . . . . . . . . . . . . . . . . 1
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
Ordering information . . . . . . . . . . . . . . . . . . . . . 2
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 3
Pinning information . . . . . . . . . . . . . . . . . . . . . . 4
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 4
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 4
Functional description . . . . . . . . . . . . . . . . . . . 5
General . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 5
Device control . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Write mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 6
Read mode . . . . . . . . . . . . . . . . . . . . . . . . . . . . 9
Power-on reset . . . . . . . . . . . . . . . . . . . . . . . . 10
Internal circuitry. . . . . . . . . . . . . . . . . . . . . . . . 11
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . 15
Thermal characteristics. . . . . . . . . . . . . . . . . . 15
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . 16
Application information. . . . . . . . . . . . . . . . . . 23
Tuning amplifier. . . . . . . . . . . . . . . . . . . . . . . . 23
Crystal oscillator . . . . . . . . . . . . . . . . . . . . . . . 23
Examples of I²C-bus control . . . . . . . . . . . . . . 23
Write sequence. . . . . . . . . . . . . . . . . . . . . . . . 23
Read sequence. . . . . . . . . . . . . . . . . . . . . . . . 24
Test information . . . . . . . . . . . . . . . . . . . . . . . . 24
Measurement circuit . . . . . . . . . . . . . . . . . . . . 24
Test circuit for low band measurements . . . . . 27
Test circuit for mid and high band
measurements . . . . . . . . . . . . . . . . . . . . . . . . 29
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 31
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Introduction to soldering surface mount
packages . . . . . . . . . . . . . . . . . . . . . . . . . . . . 32
Reflow soldering . . . . . . . . . . . . . . . . . . . . . . . 32
Wave soldering . . . . . . . . . . . . . . . . . . . . . . . . 32
Manual soldering . . . . . . . . . . . . . . . . . . . . . . 33
Package related soldering information . . . . . . 33
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 35
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 36
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Trademarks. . . . . . . . . . . . . . . . . . . . . . . . . . . . 36
Contact information . . . . . . . . . . . . . . . . . . . . 36
© Koninklijke Philips Electronics N.V. 2005
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner. The information presented in this document does
not form part of any quotation or contract, is believed to be accurate and reliable and may
be changed without notice. No liability will be accepted by the publisher for any
consequence of its use. Publication thereof does not convey nor imply any license under
patent- or other industrial or intellectual property rights.
Date of release: 14 June 2005
Document number: 9397 750 15057
Published in The Netherlands