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TDA8927 Datasheet, PDF (31/36 Pages) NXP Semiconductors – Power stage 2 x 80 W class-D audio amplifier
Philips Semiconductors
Power stage 2 × 80 W class-D
audio amplifier
Objective specification
TDA8927
RDBS17P: plastic rectangular-DIL-bent-SIL power package; 17 leads (row spacing 2.54 mm)
non-concave
D
x
Dh
SOT577-1
Eh
d
j
view B: mounting base side
A2
B
E
1
17
Z
e1
wM
bp
e
A
e2 c
LQ
L1
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A2 bp
c D(1) d
Dh E(1)
e
e1 e2 Eh
j
L L1
Q vw
x Z(1)
mm
13.5
4.6
4.4
0.75 0.48 24.0 20.0
0.60 0.38 23.6 19.6
10
12.2
11.8
2.54
1.27
2.54
6
3.4
3.1
4.7
4.1
4.7
4.1
2.1
1.8
0.6
0.4
0.03
2.00
1.45
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT577-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
00-01-19
00-03-15
2001 Dec 11
31