TDA8927 Datasheet, PDF (11/36 Pages) NXP Semiconductors – Power stage 2 x 80 W class-D audio amplifier

Philips Semiconductors
Power stage 2 × 80 W class-D
audio amplifier
Objective specification
TDA8927
9 LIMITING VALUES
In accordance with the Absolute Maximum Rate System (IEC 60134).
SYMBOL
V_P
V_P(sc)
I_ORM
T_stg
T_amb
T_vj
V_es(HBM)
V_es(MM)
PARAMETER
CONDITIONS
MIN.
supply voltage
−
supply voltage for
−
short-circuits across the load
repetitive peak current in
−
output pins
storage temperature
−55
ambient temperature
−40
virtual junction temperature
−
electrostatic discharge
voltage (HBM)
note 1
all pins with respect to V_DD (class A) −500
all pins with respect to V_SS (class A1) −1500
all pins with respect to each other
−1 500
(class A1)
electrostatic discharge
voltage (MM)
note 2
all pins with respect to V_DD (class B)
all pins with respect to V_SS (class B)
all pins with respect to each other
(class B)
−250
−250
−250
MAX.
±30
±30
7.5
+150
+85
150
+500
+1 500
+1 500
+250
+250
+250
UNIT
V
V
A
°C
°C
°C
V
V
V
V
V
V
Notes
1. Human Body Model (HBM); R_s = 1500 Ω; C = 100 pF.
2. Machine Model (MM); R_s = 10 Ω; C = 200 pF; L = 0.75 µH.
10 THERMAL CHARACTERISTICS
SYMBOL
R_th(j-a)
R_th(j-c)
PARAMETER
thermal resistance from junction to ambient
TDA8927J
TDA8927ST
TDA8927TH
thermal resistance from junction to case
TDA8927J
TDA8927ST
TDA8927TH
CONDITIONS
in free air
in free air
VALUE
40
40
40
≈1.0
≈1.0
1
UNIT
K/W
K/W
K/W
K/W
K/W
K/W
11 QUALITY SPECIFICATION
In accordance with “SNW-FQ611-part D” if this type is used as an audio amplifier.
2001 Dec 11
11