TDA8927 Datasheet, PDF (2/36 Pages) NXP Semiconductors – Power stage 2 x 80 W class-D audio amplifier

Philips Semiconductors
Power stage 2 × 80 W class-D
audio amplifier
Objective specification
TDA8927
CONTENTS
1
2
3
4
5
6
7
8
8.1
8.2
8.2.1
8.2.2
8.3
9
10
11
12
13
14
14.1
FEATURES
APPLICATIONS
GENERAL DESCRIPTION
QUICK REFERENCE DATA
ORDERING INFORMATION
BLOCK DIAGRAMS
PINNING INFORMATION
FUNCTIONAL DESCRIPTION
Power stage
Protections
Overtemperature
Short-circuit across the loudspeaker terminals
BTL operation
LIMITING VALUES
THERMAL CHARACTERISTICS
QUALITY SPECIFICATION
DC CHARACTERISTICS
AC CHARACTERISTICS
SWITCHING CHARACTERISTICS
Duty factor
15
15.1
15.2
15.3
15.4
15.5
15.6
16
17
17.1
17.2
17.2.1
17.2.2
17.3
17.3.1
17.3.2
17.3.3
17.4
18
19
20
TEST AND APPLICATION INFORMATION
BTL application
Remarks
Output power
Reference designs
Reference design bill of material
Curves measured in reference design
PACKAGE OUTLINES
SOLDERING
Introduction
Through-hole mount packages
Soldering by dipping or by solder wave
Manual soldering
Surface mount packages
Reflow soldering
Wave soldering
Manual soldering
Suitability of IC packages for wave, reflow and
dipping soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
2001 Dec 11
2