UJA1065 Datasheet, PDF (3/67 Pages) NXP Semiconductors – High-speed CAN/LIN fail-safe system basis chip

Philips Semiconductors
UJA1065
High-speed CAN/LIN fail-safe system basis chip
2.4 Power management
s Smart operating modes and power management modes
s Cyclic wake-up capability in Standby and Sleep mode
s Local wake-up input with cyclic supply feature
s Remote wake-up capability via the CAN-bus and LIN-bus
s External voltage regulators can easily be incorporated in the power supply system
(flexible and fail-safe)
s 42 V battery related high-side switch for driving external loads such as relays and
wake-up switches
s Intelligent maskable interrupt output
2.5 Fail-safe features
s Safe and predictable behavior under all conditions
s Programmable fail-safe coded window and time-out watchdog with on-chip oscillator,
guaranteeing autonomous fail-safe system supervision
s Fail-safe coded 16-bit SPI interface for the microcontroller
s Global enable pin for the control of safety critical hardware
s Detection and detailed reporting of failures:
x On-chip oscillator failure and watchdog alerts
x Battery and voltage regulator undervoltages
x CAN and LIN-bus failures (short-circuits and open-circuit bus wires)
x TXD and RXD clamping situations and short-circuits
x Clamped or open reset line
x SPI message errors
x Overtemperature warning
x ECU ground shift (two selectable thresholds)
s Rigorous error handling based on diagnostics
s Supply failure early warning allows critical data to be stored
s 23 bits of access-protected RAM is available e.g. for logging of cyclic problems
s Reporting in a single SPI message; no assembly of multiple SPI frames needed
s Limp home output signal for activating application hardware in case system enters
Fail-safe mode (e.g. for switching on warning lights)
s Fail-safe coded activation of Software development mode and Flash mode
s Unique SPI readable device type identification
s Software initiated system reset
3. Ordering information
Table 1: Ordering information
Type number
Package
Name
UJA1065TW
HTSSOP32
Description
Version
plastic thermal enhanced thin shrink small outline package; 32 leads; SOT549-1
body width 6.1 mm; lead pitch 0.65 mm; exposed die pad
9397 750 14409
Objective data sheet
Rev. 01 — 10 August 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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