TDA8008 Datasheet, PDF (3/12 Pages) NXP Semiconductors – Dual multiprotocol smart card coupler

Philips Semiconductors
Dual multiprotocol smart card coupler
Objective specification
TDA8008
QUICK REFERENCE DATA
SYMBOL
PARAMETER
CONDITIONS
MIN. TYP. MAX. UNIT
V_DD
I_DD(pd)
I_DD(sm)
I_DD(om)
V_CC
I_CC
I_CC1 + I_CC2
SR
t_de
t_act
f_XTAL
f_op
T_amb
supply voltage
V_DDD = V_DDA = V_DDP
2.7
supply current in Power-down mode V_DD = 3.3 V; cards inactive;
−
8xC51 controller in power-down
mode; note 1
supply current in sleep mode
V_DD = 3.3 V; cards active at
−
V_CC = 5V; clock stopped; 8xC51
controller in Idle mode; note 1
supply current in operating mode V_DD = 3.3 V; f_XTAL1 = 20 MHz −
V_CC1 = V_CC2 = 5 V;
I_CC1 + I_CC2 = 80 mA; note 1
card output supply voltage
including static loads (5 V card) 4.75
with 40 nAs dynamic loads on 4.6
200 nF capacitor (5 V card)
including static loads (3 V card) 2.80
with 40 nAs dynamic loads on 2.75
200 nF capacitor (3 V card)
card output supply current
operating
−
overload detection
−
sum of both cards currents
−
slew rate on V_CC (rise and fall)
C_L = 300 nF (max.)
0.10
deactivation cycle duration
−
activation cycle duration
−
crystal frequency
3.5
operating frequency
external frequency applied to 0
pin XTAL1
ambient temperature
−25
−
−
−
−
5.0
5.0
3.0
3.0
−
80
−
0.16
−
−
−
−
−
5.5
tbf
tbf
tbf
5.25
5.4
3.20
3.25
65
−
80
0.22
100
225
25
25
+85
V
µA
mA
mA
V
V
V
V
mA
mA
mA
V/µs
µs
µs
MHz
MHz
°C
Note
1. I_DD in all configurations includes the current at pins V_DDD, V_DDA and V_DDP.
1999 Dec 14
3