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BUK653R3-30C_15 Datasheet, PDF (3/14 Pages) NXP Semiconductors – N-channel TrenchMOS intermediate level FET
NXP Semiconductors
BUK653R3-30C
N-channel TrenchMOS intermediate level FET
4. Limiting values
Table 4. Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol
VDS
VGS
Parameter
drain-source voltage
gate-source voltage
Conditions
Tj ≥ 25 °C; Tj ≤ 175 °C
DC
Pulsed
ID
drain current
IDM
peak drain current
Tmb = 25 °C; VGS = 10 V; see Figure 1
Tmb = 100 °C; VGS = 10 V; see Figure 1
Tmb = 25 °C; pulsed; tp ≤ 10 µs;
see Figure 3
Ptot
total power dissipation
Tstg
storage temperature
Tj
junction temperature
Source-drain diode
Tmb = 25 °C; see Figure 2
IS
source current
ISM
peak source current
Avalanche ruggedness
EDS(AL)S
non-repetitive drain-source
avalanche energy
EDS(AL)R
repetitive drain-source
avalanche energy
Tmb = 25 °C
pulsed; tp ≤ 10 µs; Tmb = 25 °C
ID = 100 A; Vsup ≤ 30 V; RGS = 50 Ω;
VGS = 10 V; Tj(init) = 25 °C; unclamped
Min
-
[1] -16
[2] -20
[3] -
[3] -
-
-
-55
-55
[3] -
-
-
[4][5][6] -
[1] -16V accumulated duration not to exceed 168 hrs
[2] Accumulated pulse duration not to exceed 5mins.
[3] Continuous current is limited by package.
[4] Single-pulse avalanche rating limited by maximum junction temperature of 175 °C.
[5] Repetitive avalanche rating limited by an average junction temperature of 170 °C.
[6] Refer to application note AN10273 for further information.
Max Unit
30 V
16 V
20 V
100 A
100 A
721 A
204 W
175 °C
175 °C
100 A
721 A
501 mJ
-
J
BUK653R3-30C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 1 — 13 July 2011
© NXP B.V. 2011. All rights reserved.
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