SA58632 Datasheet, PDF (24/26 Pages) NXP Semiconductors – 2 x 2.2 W BTL audio amplifier

Philips Semiconductors
SA58632
2 × 2.2 W BTL audio amplifier
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
17. Abbreviations
Table 11. Abbreviations
Acronym
Description
BTL
Bridge-Tied Load
CMOS
Complementary Metal Oxide Semiconductor
DAP
Die Attach Paddle
ESD
ElectroStatic Discharge
NPN
Negative-Positive-Negative
PCB
Printed-Circuit Board
PNP
Positive-Negative-Positive
RMS
Root Mean Squared
SE
Single-Ended
THD
Total Harmonic Distortion
18. Revision history
Table 12. Revision history
Document ID
Release date
SA58632_1
20060627
Data sheet status
Product data sheet
Change notice
-
Supersedes
-
SA58632_1
Product data sheet
Rev. 01 — 27 June 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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