SA58632 Datasheet, PDF (21/26 Pages) NXP Semiconductors – 2 x 2.2 W BTL audio amplifier

Philips Semiconductors
15. Package outline
HVQFN20: plastic thermal enhanced very thin quad flat package; no leads;
20 terminals; body 6 x 5 x 0.85 mm
D
BA
terminal 1
index area
E
A
A₁
SA58632
2 × 2.2 W BTL audio amplifier
SOT910-1
c
detail X
L
6
e
7
e₁
1/2 e
b
10
vM C A B
wM C
11
e
y₁ C
C
y
E_h
e₂
1/2 e
1
16
terminal 1
index area
20
17
D_h
X
0
2.5
DIMENSIONS (mm are the original dimensions)
scale
UNIT
A
max
A₁
b
c
D D_h
E E_h
e
e₁
mm
1
0.05 0.4
0.00 0.3
0.2
5.1
4.9
3.15
2.85
6.1
5.9
4.15
3.85
0.8
2.4
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT910-1
---
MO-220
---
5 mm
e₂
L
v
w
y
y₁
4
0.65
0.40
0.1
0.05 0.05
0.1
EUROPEAN
PROJECTION
ISSUE DATE
05-10-11
Fig 24. Package outline SOT910-1 (HVQFN20)
SA58632_1
Product data sheet
Rev. 01 — 27 June 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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