TDA8005 Datasheet, PDF (22/32 Pages) NXP Semiconductors – Low-power smart card coupler

Philips Semiconductors
Low-power smart card coupler
Product specification
TDA8005
SYMBOL
PARAMETER
CONDITIONS
MIN.
Reset output to the card (RST)
V_inactive output voltage
I_inactive
current from RST when
inactive and pin grounded
V_OL
LOW level output voltage
V_OH
HIGH level output voltage
t_r
rise time
t_f
fall time
Clock output to the card (CLK)
V_inactive output voltage
I_inactive
V_OL
V_OH
t_r
t_f
f_clk
current from CLK when
inactive and pin grounded
LOW level output voltage
HIGH level output voltage
rise time
fall time
clock frequency
δ
duty cycle
Card supply voltage (V_CC)
V_inactive output voltage
I_inactive
V_cc
current from VCC when
inactive and pin grounded
output voltage in active mode
with 100 nF capacitor;
when inactive
when LIS is used; I_inactive = 1 mA
−0.3
−0.3
−
I_OL = 200 µA
I_OH <−200 µA
C_L = 30 pF
C_L = 30 pF
−0.25
4
−
−
when inactive
when LIS is used; I_inactive = 1 mA
−0.3
−0.3
−
I_OL = 200 µA
I_OH <−200 µA
C_L = 30 pF
C_L = 30 pF
1 MHz Idle configuration
low operating speed
middle operating speed
high operating speed
C_L = 30 pF
−0.25
V_CC−0.5
−
−
1
−
−
−
45
when inactive
when LIS is used; I_inactive = 1 mA
−0.3
−0.3
−
I_max = 200 mA, f_max = 5 MHz, and −
duration <400 ns
TYP. MAX. UNIT
−
0.4
V
−
0.4
V
−
−1
mA
−
0.4
V
−
V_CC + 0.3 V
−
1
µs
−
1
µs
−
0.4
V
−
0.4
V
−
−1
mA
−
0.4
V
−
V_CC+0.25 V
−
15
ns
−
15
ns
−
1.5
MHz
−
2
MHz
−
4
MHz
−
8
MHz
−
55
%
−
0.4
V
−
0.4
V
−
−1
mA
−
−
V
static load (up to 20 mA)
dynamic current of 40 nA
4.75
5.25
4.5
5.5
I_CC
output current
SR
slew rate
V_CC = 5V
V_CC shorted to GND
up or down
(max capacitance is 150 nF)
−
−
0.04
−
−20
−
−40
0.1 0.16
mA
mA
V/µs
1996 Sep 25
22