PIP202-12M Datasheet, PDF (20/20 Pages) NXP Semiconductors – DC to DC converter powertrain

Philips Semiconductors
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4
Ordering information . . . . . . . . . . . . . . . . . . . . . 1
5
Block diagram . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6
Pinning information . . . . . . . . . . . . . . . . . . . . . . 2
6.1
Pinning . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 2
6.2
Pin description . . . . . . . . . . . . . . . . . . . . . . . . . 3
7
Functional description . . . . . . . . . . . . . . . . . . . 3
7.1
Basic functionality . . . . . . . . . . . . . . . . . . . . . . . 3
7.2
MOSFET driver function . . . . . . . . . . . . . . . . . . 4
7.3
Bootstrap diode. . . . . . . . . . . . . . . . . . . . . . . . . 4
7.4
3-state function . . . . . . . . . . . . . . . . . . . . . . . . . 5
8
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 5
9
Thermal characteristics. . . . . . . . . . . . . . . . . . . 6
10
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 6
11
Application information. . . . . . . . . . . . . . . . . . . 9
11.1
Typical application. . . . . . . . . . . . . . . . . . . . . . . 9
11.2
Advantages of an integrated driver . . . . . . . . . 10
11.3
External connection of power and signal lines 10
11.4
Switching frequency . . . . . . . . . . . . . . . . . . . . 11
11.5
Thermal design. . . . . . . . . . . . . . . . . . . . . . . . 11
12
Test information . . . . . . . . . . . . . . . . . . . . . . . . 13
13
Marking . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14
Package outline . . . . . . . . . . . . . . . . . . . . . . . . 14
15
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 15
15.1
Introduction to soldering MLF packages. . . . . 15
15.2
Rework guidelines . . . . . . . . . . . . . . . . . . . . . 16
16
Mounting. . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 16
16.1
PCB design guidelines . . . . . . . . . . . . . . . . . . 16
16.2
Solder paste printing. . . . . . . . . . . . . . . . . . . . 17
17
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 18
18
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 19
19
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
20
Disclaimers . . . . . . . . . . . . . . . . . . . . . . . . . . . . 19
PIP202-12M
DC to DC converter powertrain
© Koninklijke Philips Electronics N.V. 2002.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 15 July 2002
Document order number: 9397 750 10031