PIP202-12M Datasheet, PDF (14/20 Pages) NXP Semiconductors – DC to DC converter powertrain

Philips Semiconductors
PIP202-12M
DC to DC converter powertrain
14. Package outline
HVQFN68: plastic thermal enhanced very thin quad flat package; no leads;
68 terminals; body 10 x 10 x 0.85 mm
D
B
D1
A
SOT687-1
terminal 1
index area
E1 E
A
A4
A1
c
detail X
terminal 1
index area
1
L
68
Eh1
e1
e
b
17
vMC A B
wM C
18
e
e2
y1 _C
C
y
Eh1
52
34
51
35
Dh1
Dh1
X
Dh
0
2.5
5 mm
DIMENSIONS (mm are the original dimensions)
scale
UNIT
A
max.
A1
A4
b
c
D D1 Dh Dh1 E E1 Eh1 e e1 e2 L
v
w
y y1
mm
1
0.05 0.80 0.30
0.00 0.65 0.18
0.2
10.15 9.95
9.85 9.55
7.85
7.55
3.8 10.15 9.95
3.5 9.85 9.55
3.8
3.5
0.5
8
8
0.75
0.50
0.1
0.05 0.05
0.1
OUTLINE
VERSION
IEC
SOT687-1
---
REFERENCES
JEDEC
JEITA
MO-220
---
EUROPEAN
PROJECTION
ISSUE DATE
01-12-04
02-04-24
Fig 17. SOT687-1.
9397 750 10031
Product data
Rev. 01 — 15 July 2002
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
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