TDA8591J Datasheet, PDF (2/36 Pages) NXP Semiconductors – 4 X 44 W into 4 or 4 X 75 W into 2 quad BTL car radio power amplifier

Philips Semiconductors
4 × 44 W into 4 Ω or 4 × 75 W into 2 Ω
quad BTL car radio power amplifier
CONTENTS
15
1
FEATURES
16
2
GENERAL DESCRIPTION
16.1
3
ORDERING INFORMATION
16.2
4
QUICK REFERENCE DATA
16.3
5
BLOCK DIAGRAM
16.4
6
PINNING
17
7
FUNCTIONAL DESCRIPTION
18
7.1
Diagnostic facility
7.2
Diagnostic output (DIAG)
19
7.3
Mute timer and single-pin mute control
7.4
Output power
8
LIMITING VALUES
9
THERMAL CHARACTERISTICS
10
QUALITY SPECIFICATION
11
DC CHARACTERISTICS
12
AC CHARACTERISTICS
12.1
Performance curves
13
TEST INFORMATION
13.1
Protection circuit testing
14
APPLICATION INFORMATION
14.1
Special attention for SMD input capacitors
14.2
Capacitors on outputs
14.3
EMC precautions
14.4
Offset detection
14.5
Channel selection
14.6
Detection of short-circuits
14.7
PCB layout
14.8
PCB design advice
Preliminary specification
TDA8591J
PACKAGE OUTLINE
SOLDERING
Introduction to soldering through-hole mount
packages
Soldering by dipping or by solder wave
Manual soldering
Suitability of through-hole mount IC packages
for dipping and wave soldering methods
DATA SHEET STATUS
DEFINITIONS
DISCLAIMERS
2002 Jan 14
2