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BUK7830-30 Datasheet, PDF (2/10 Pages) NXP Semiconductors – TrenchMOS transistor Standard level FET
Philips Semiconductors
TrenchMOS™ transistor
Standard level FET
Product specification
BUK7830-30
ESD LIMITING VALUE
SYMBOL
VC
PARAMETER
Electrostatic discharge capacitor
voltage, all pins
CONDITIONS
Human body model
(100 pF, 1.5 kΩ)
MIN.
-
MAX.
2
UNIT
kV
STATIC CHARACTERISTICS
Tj= 25˚C unless otherwise specified
SYMBOL PARAMETER
CONDITIONS
V(BR)DSS
VGS(TO)
IDSS
IGSS
±V(BR)GSS
RDS(ON)
Drain-source breakdown
VGS = 0 V; ID = 0.25 mA;
voltage
Tj = -55˚C
Gate threshold voltage
VDS = VGS; ID = 1 mA
Tj = 150˚C
Tj = -55˚C
Zero gate voltage drain current VDS = 30 V; VGS = 0 V;
Tj = 150˚C
Gate source leakage current VGS = ±10 V; VDS = 0 V
Tj = 150˚C
Gate source breakdown voltage IG = ±1 mA;
Drain-source on-state
VGS = 10 V; ID = 3.2 A
resistance
Tj = 150˚C
MIN.
30
27
2.0
1.0
-
-
-
-
-
16
-
-
TYP.
-
-
3.0
-
-
0.05
-
0.02
-
-
24
-
MAX.
-
-
4.0
-
4.4
10
500
1
20
-
30
51
UNIT
V
V
V
V
µA
µA
µA
µA
V
mΩ
mΩ
DYNAMIC CHARACTERISTICS
Tj = 25˚C unless otherwise specified
SYMBOL PARAMETER
gfs
Qg(tot)
Qgs
Qgd
Ciss
Coss
Crss
td on
tr
td off
tf
Ld
Forward transconductance
Total gate charge
Gate-source charge
Gate-drain (Miller) charge
Input capacitance
Output capacitance
Feedback capacitance
Turn-on delay time
Turn-on rise time
Turn-off delay time
Turn-off fall time
Internal drain inductance
Ld
Internal drain inductance
Ls
Internal source inductance
CONDITIONS
VDS = 25 V; ID = 5.9 A
ID = 5.9 A; VDD = 24 V; VGS = 10 V
VGS = 0 V; VDS = 25 V; f = 1 MHz
VDD = 15 V; ID = 5.9 A;
VGS = 10 V; RG = 5 Ω
Resistive load
Measured from contact screw on
tab to centre of die
Measured from drain lead 6 mm
from package to centre of die
Measured from source lead 6 mm
from package to source bond pad
MIN.
5
-
-
-
-
-
-
-
-
-
-
-
TYP.
10
22.5
4.5
9
740
270
130
16
30
35
25
3.5
MAX.
-
-
-
-
-
-
-
22
60
50
38
-
UNIT
S
nC
nC
nC
pF
pF
pF
ns
ns
ns
ns
nH
-
4.5
-
nH
-
7.5
-
nH
December 1997
2
Rev 1.100