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BUK7107-40ATC Datasheet, PDF (2/16 Pages) NXP Semiconductors – TrenchPLUS standard level FET
Philips Semiconductors
BUK71/7907-40ATC
TrenchPLUS standard level FET
3. Limiting values
Table 2: Limiting values
In accordance with the Absolute Maximum Rating System (IEC 60134).
Symbol Parameter
Conditions
Min
VDS
VDGS
VGS
ID
drain-source voltage (DC)
drain-gate voltage (DC)
gate-source voltage (DC)
drain current (DC)
IDG = 250 µA
Tmb = 25 °C; VGS = 10 V;
Figure 2 and 3
[1] -
[1] -
-
[2] -
[3] -
IDM
peak drain current
Tmb = 100 °C; VGS = 10 V; Figure 2
Tmb = 25 °C; pulsed; tp ≤ 10 µs;
Figure 3
[3] -
-
Ptot
total power dissipation
Tmb = 25 °C; Figure 1
-
IDG(CL)
drain-gate clamping current
tp = 5 ms; δ = 0.01
-
IGS(CL)
gate-source clamping current
continuous
-
tp = 5 ms; δ = 0.01
-
Visol(FET-TSD) FET to temperature sense diode
-
isolation voltage
Tstg
storage temperature
−55
Tj
junction temperature
−55
Source-drain diode
IDR
reverse drain current
Tmb = 25 °C
[2] -
[3] -
IDRM
peak reverse drain current
Tmb = 25 °C; pulsed; tp ≤ 10 µs
-
Clamping
EDS(CL)S
non-repetitive drain-source clamping unclamped inductive load; ID = 75 A;
-
energy
VDS ≤ 40 V; VGS = 10 V; RGS = 10 kΩ;
starting Tj = 25 °C
Electrostatic Discharge
Vesd
electrostatic discharge voltage; pins Human Body Model; C = 100 pF;
1,3,5
R = 1.5 kΩ
[1] Voltage is limited by clamping
[2] Current is limited by power dissipation chip rating
[3] Continuous current is limited by package.
Max Unit
40
V
40
V
±20 V
140 A
75
A
75
A
560 A
272 W
50
mA
10
mA
50
mA
±100 V
+175 °C
+175 °C
140 A
75
A
560 A
1.4 J
6
kV
9397 750 09874
Product data
Rev. 01 — 9 August 2002
© Koninklijke Philips Electronics N.V. 2002. All rights reserved.
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