74HC283N Datasheet, PDF (2/20 Pages) NXP Semiconductors – 4-bit binary full adder with fast carry

Philips Semiconductors
74HC283
4-bit binary full adder with fast carry
3. Quick reference data
Table 1: Quick reference data
GND = 0 V; T_amb = 25 °C; t_r = t_f = 6 ns.
Symbol Parameter
Conditions
Min Typ
t_PHL, t_PLH propagation delay
C_L = 15 pF; V_CC = 5 V
CIN to S1
-
16
CIN to S2
-
18
CIN to S3
-
20
CIN to S4
-
23
An or Bn to Sn
-
21
CIN to COUT
-
20
An or Bn to COUT
-
20
C_I
input capacitance
-
3.5
C_PD
power dissipation
V_I = GND to V_CC
[1] _-
88
capacitance
[1] C_PD is used to determine the dynamic power dissipation (P_D in µW).
P_D = C_PD × V_CC2 × f_i × N + ∑(C_L × V_CC2 × f_o) where:
f_i = input frequency in MHz;
f_o = output frequency in MHz;
C_L = output load capacitance in pF;
V_CC = supply voltage in V;
N = number of inputs switching;
∑(C_L × V_CC2 × f_o) = sum of outputs.
4. Ordering information
Max Unit
-
ns
-
ns
-
ns
-
ns
-
ns
-
ns
-
ns
-
pF
-
pF
Table 2: Ordering information
Type number Package
Temperature range
74HC283N
−40 °C to +125 °C
74HC283D
−40 °C to +125 °C
74HC283DB
−40 °C to +125 °C
74HC283PW −40 °C to +125 °C
Name
DIP16
SO16
SSOP16
TSSOP16
Description
plastic dual in-line package; 16 leads (300 mil)
plastic small outline package; 16 leads;
body width 3.9 mm
plastic shrink small outline package; 16 leads;
body width 5.3 mm
plastic thin shrink small outline package;
16 leads; body width 4.4 mm
Version
SOT38-4
SOT109-1
SOT338-1
SOT403-1
9397 750 13811
Product data sheet
Rev. 03 — 11 November 2004
© Koninklijke Philips Electronics N.V. 2004. All rights reserved.
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