TDA8310A Datasheet, PDF (19/24 Pages) NXP Semiconductors – PAL/NTSC colour processor for PIP applications

Philips Semiconductors
PAL/NTSC colour processor
for PIP applications
PACKAGE OUTLINE
SDIP52: plastic shrink dual in-line package; 52 leads (600 mil)
Product specification
TDA8310A
SOT247-1
L
Z
52
pin 1 index
D
e
b
M_E
A_{2 A}
A₁
wM
b₁
c
(e ₁)
M_H
27
E
1
26
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
min.
A₂
max.
b
b₁
c
D ⁽¹⁾
E ⁽¹⁾
e
e₁
L
M_E
M_H
w
Z ⁽¹⁾
max.
mm 5.08 0.51 4.0
1.3
0.8
0.53
0.40
0.32
0.23
47.9
47.1
14.0
13.7
1.778 15.24
3.2
2.8
15.80 17.15
15.24 15.90
0.18
1.73
Note
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
SOT247-1
REFERENCES
JEDEC
EIAJ
EUROPEAN
PROJECTION
ISSUE DATE
90-01-22
95-03-11
1996 Jan 25
19