PDIUSBD11 Datasheet, PDF (18/20 Pages) NXP Semiconductors – USB device with serial interface

Philips Semiconductors
USB device with serial interface
Product specification
PDIUSBD11
SUITABILITY OF IC PACKAGES FOR WAVE, REFLOW AND DIPPING SOLDERING METHODS
Mounting
Through-hole mount
Surface mount
Package
DBS, DIP, HDIP, SDIP, SIL
BGA, SQFP,
HLQFP, HSQFP, HSOP, SMS
PLCC, SO, SOJ
LQFP, QFP, TQFP
SSOP, TSSOP, VSO
Wave
suitable ²
not suitable
not suitable ³
suitable
not recommended ^{4, 5}
not recommended ⁶
Soldering Method
Reflow ¹
–
suitable
suitable
suitable
suitable
suitable
Dipping
suitable
–
–
–
–
–
NOTES:
1. All surface mount (SMD) packages are moisture sensitive. Depending upon the moisture content, the maximum temperature (with respect to
time) and body size of the package, there is a risk that internal or external package cracks may occur due to vaporization of the moisture in
them (the so-called “popcorn” effect). For details, refer to the Drypack information in the “Data Handbook IC26; Integrated Circuit Packages;
Section: Packing Methods”.
2. For SDIP packages, the longitudinal axis must be parallel to the transport direction of the printed-circuit board.
3. These packages are not suitable for wave soldering as a solder joint between the printed-circuit board and heatsink (at bottom version)
cannot be achieved, and as solder may stick to the heatsink (on top version).
4. If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave direction. The package footprint must
incorporate solder thieves downstream and at the side corners.
5. Wave soldering is only suitable for LQFP, QFP, and TQFP packages with a pitch (e) equal to or larger than 0.8 mm; it is definitely not
suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
6. Wave soldering is only suitable for SSOP and TSSOP packages with a pith (e) equal to or larger than 0.65 mm; it is definitely not suitable for
packages with a pitch (e) equal to or smaller than 0.5 mm.
1999 Jul 22
18