GTL2008 Datasheet, PDF (18/20 Pages) NXP Semiconductors – 12-bit GTL to LVTTL translator with power good control and high-impedance LVTTL and GTL outputs

Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
[3] These transparent plastic packages are extremely sensitive to reflow soldering conditions and must on no
account be processed through more than one soldering cycle or subjected to infrared reflow soldering with
peak temperature exceeding 217 °C ± 10 °C measured in the atmosphere of the reflow oven. The package
body peak temperature must be kept as low as possible.
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
16. Abbreviations
Table 17. Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal Oxide Semiconductor
CPU
Central Processing Unit
DUT
Device Under Test
ESD
ElectroStatic Discharge
GTL
Gunning Transceiver Logic
HBM
Human Body Model
LVTTL
Low Voltage Transistor-Transistor Logic
MM
Machine Model
PRR
Pulse Rate Repetition
TTL
Transistor-Transistor Logic
VRD
Voltage Regulator Down
17. Revision history
Table 18. Revision history
Document ID
Release date Data sheet status
Change notice Supersedes
GTL2008_GTL2107_2
Modifications:
20060926
Product data sheet
-
GTL2008_1
• Added type number GTL2017
• Section 1 “General description”: added new 7th paragraph
• Section 4 “Ordering information”: added type number GTL2107PW to Table 2 “Ordering
information” and following paragraph
• Table 10 “Limiting values”: removed (old) Table note 1 (information is now in Section 18
“Legal information”)
• added “DUT” to Table 17 “Abbreviations”
GTL2008_1
20060502
Product data sheet
-
-
GTL2008_GTL2107_2
Product data sheet
Rev. 02 — 26 September 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
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