GTL2008 Datasheet, PDF (15/20 Pages) NXP Semiconductors – 12-bit GTL to LVTTL translator with power good control and high-impedance LVTTL and GTL outputs

Philips Semiconductors
GTL2008; GTL2107
GTL translator with power good control and high-impedance outputs
14. Package outline
TSSOP28: plastic thin shrink small outline package; 28 leads; body width 4.4 mm
SOT361-1
D
y
Z
28
pin 1 index
1
e
E
A
X
c
H_E
vM A
15
14
wM
b_p
A₂
A₁
Q
(A ₃)
A
θ
L_p
L
detail X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max.
A₁
A₂
A₃
b_p
c
D ⁽¹⁾ E ⁽²⁾
e
H_E
mm
1.1
0.15
0.05
0.95
0.80
0.25
0.30
0.19
0.2
0.1
9.8
9.6
4.5
4.3
0.65
6.6
6.2
Notes
1. Plastic or metal protrusions of 0.15 mm maximum per side are not included.
2. Plastic interlead protrusions of 0.25 mm maximum per side are not included.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
JEITA
SOT361-1
MO-153
L
L_p
Q
v
w
y
Z ⁽¹⁾
θ
1
0.75 0.4
0.50 0.3
0.2 0.13 0.1
0.8
0.5
8^o
0^o
EUROPEAN
PROJECTION
ISSUE DATE
99-12-27
03-02-19
Fig 16. Package outline SOT361-1 (TSSOP28)
GTL2008_GTL2107_2
Product data sheet
Rev. 02 — 26 September 2006
© Koninklijke Philips Electronics N.V. 2006. All rights reserved.
15 of 20