GTL2007 Datasheet, PDF (17/19 Pages) NXP Semiconductors – 13-bit GTL to LVTTL translator with power good control

Philips Semiconductors
GTL2007
13-bit GTL to LVTTL translator with power good control
[4] These packages are not suitable for wave soldering. On versions with the heatsink on the bottom side, the
solder cannot penetrate between the printed-circuit board and the heatsink. On versions with the heatsink
on the top side, the solder might be deposited on the heatsink surface.
[5] If wave soldering is considered, then the package must be placed at a 45° angle to the solder wave
direction. The package footprint must incorporate solder thieves downstream and at the side corners.
[6] Wave soldering is suitable for LQFP, QFP and TQFP packages with a pitch (e) larger than 0.8 mm; it is
definitely not suitable for packages with a pitch (e) equal to or smaller than 0.65 mm.
[7] Wave soldering is suitable for SSOP, TSSOP, VSO and VSSOP packages with a pitch (e) equal to or larger
than 0.65 mm; it is definitely not suitable for packages with a pitch (e) equal to or smaller than 0.5 mm.
[8] Image sensor packages in principle should not be soldered. They are mounted in sockets or delivered
pre-mounted on flex foil. However, the image sensor package can be mounted by the client on a flex foil by
using a hot bar soldering process. The appropriate soldering profile can be provided on request.
[9] Hot bar soldering or manual soldering is suitable for PMFP packages.
16. Abbreviations
Table 15: Abbreviations
Acronym
Description
CDM
Charged Device Model
CMOS
Complementary Metal Oxide Silicon
CPU
Central Processing Unit
ESD
Electrostatic Discharge
GTL
Gunning Transceiver Logic
HBM
Human Body Model
LVTTL
Low Voltage Transistor-Transistor Logic
MM
Machine Model
PRR
Pulse Rate Repetition
TTL
Transistor-Transistor Logic
VRD
Voltage Regulator Down
17. Revision history
Table 16: Revision history
Document ID
Release date Data sheet status
GTL2007_1
20050602
Product data sheet
Change notice Doc. number Supersedes
-
9397 750 13264 -
9397 750 13264
Product data sheet
Rev. 01 — 2 June 2005
© Koninklijke Philips Electronics N.V. 2005. All rights reserved.
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