BUK7560-100A Datasheet, PDF (15/15 Pages) NXP Semiconductors – TrenchMOS standard level FET

Philips Semiconductors
BUK7560-100A; BUK7660-100A
TrenchMOS™ standard level FET
Contents
1
Description . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
2
Features . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
3
Applications . . . . . . . . . . . . . . . . . . . . . . . . . . . . 1
4
Pinning information . . . . . . . . . . . . . . . . . . . . . . 1
5
Quick reference data . . . . . . . . . . . . . . . . . . . . . 2
6
Limiting values. . . . . . . . . . . . . . . . . . . . . . . . . . 2
7
Thermal characteristics. . . . . . . . . . . . . . . . . . . 4
7.1
Transient thermal impedance . . . . . . . . . . . . . . 4
8
Characteristics . . . . . . . . . . . . . . . . . . . . . . . . . . 5
9
Package outline . . . . . . . . . . . . . . . . . . . . . . . . . 9
10
Soldering . . . . . . . . . . . . . . . . . . . . . . . . . . . . . 11
11
Revision history . . . . . . . . . . . . . . . . . . . . . . . . 12
12
Data sheet status . . . . . . . . . . . . . . . . . . . . . . . 13
13
Definitions . . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
14
Disclaimers. . . . . . . . . . . . . . . . . . . . . . . . . . . . 13
© Philips Electronics N.V. 2001.
Printed in The Netherlands
All rights are reserved. Reproduction in whole or in part is prohibited without the prior
written consent of the copyright owner.
The information presented in this document does not form part of any quotation or
contract, is believed to be accurate and reliable and may be changed without notice. No
liability will be accepted by the publisher for any consequence of its use. Publication
thereof does not convey nor imply any license under patent- or other industrial or
intellectual property rights.
Date of release: 22 February 2001
Document order number: 9397 750 07807