TDA8359J Datasheet, PDF (14/20 Pages) NXP Semiconductors – Full bridge vertical deflection output circuit in LVDMOS

Philips Semiconductors
Full bridge vertical deflection output circuit
in LVDMOS
Product specification
TDA8359J
PACKAGE OUTLINE
DBS9P: plastic DIL-bent-SIL power package; 9 leads (lead length 12/11 mm); exposed die pad
SOT523-1
non-concave
x
q1
Eh
D
D1
P
k
q2
Dh
view B: mounting base side
A2
E
B
L3
L2
L
q
L1
1
9
Z
e1
wM
Q
c
vM
e
bp
0
5
10 mm
m
e2
DIMENSIONS (mm are the original dimensions)
scale
UNIT A2⁽²⁾ bp c D⁽¹⁾ D1⁽²⁾ Dh E⁽¹⁾ Eh e e1 e2 k L L1 L2 L3 m P Q q q1 q2 v w x Z⁽¹⁾
mm
2.7 0.80 0.58 13.2
2.3 0.65 0.48 12.8
6.2
5.8
3.5
14.7
14.3
3.5
2.54 1.27 5.08
3.0
2.0
12.4 11.4
11.0 10.0
6.7
5.5
4.5
3.7
2.8
3.4
3.1
1.15
0.85
17.5
16.3
4.85
3.8
3.6
0.8
0.3
0.02
1.65
1.10
Notes
1. Plastic or metal protrusions of 0.25 mm maximum per side are not included.
2. Plastic surface within circle area D1 may protrude 0.04 mm maximum.
OUTLINE
VERSION
IEC
REFERENCES
JEDEC
EIAJ
SOT523-1
EUROPEAN
PROJECTION
ISSUE DATE
98-11-12
00-07-03
2002 Jan 21
14