LPC1850_1112 Datasheet, PDF (133/157 Pages) NXP Semiconductors – 32-bit ARM Cortex-M3 MCU; up to 200 kB SRAM; Ethernet, two High-speed USB, LCD, and external memory controller

NXP Semiconductors
LPC1850/30/20/10
32-bit ARM Cortex-M3 microcontroller
TFBGA100: plastic thin fine-pitch ball grid array package; 100 balls; body 9 x 9 x 0.7 mm
D
BA
ball A1
index area
A₂
E
A
A₁
detail X
SOT926-1
e₁
e
1/2 e b
∅v M C A B
∅w M C
K
J
H
G
F
E
D
C
B
A
ball A1
index area
1 2 3 4 5 6 7 8 9 10
e
e₂
1/2 e
y₁ C
C
y
X
0
2.5
5 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT
A
max
A₁
A₂
b
D
E
e
e₁ e₂
v
w
y
y₁
mm
1.2
0.4 0.8 0.5
0.3 0.65 0.4
9.1
8.9
9.1
8.9
0.8
7.2
7.2 0.15 0.05 0.08 0.1
OUTLINE
VERSION
IEC
SOT926-1
---
REFERENCES
JEDEC
JEITA
---
---
EUROPEAN
PROJECTION
ISSUE DATE
05-12-09
05-12-22
Fig 44. Package outline of the TFBGA100 package
LPC1850_30_20_10
Preliminary data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 3 — 6 December 2011
© NXP B.V. 2011. All rights reserved.
133 of 157