BUK7511-55B Datasheet, PDF (13/16 Pages) NXP Semiconductors – TRENCHMOS-TM STANDARD LEVEL FET

Philips Semiconductors
8. Soldering
handbook, full pagewidth
1.50
2.25 2.15
8.15 8.35
1.50
4.60
0.30
4.85
7.95
3.00
solder lands
solder resist
occupied area
solder paste
Dimensions in mm.
Fig 19. Reflow soldering footprint for SOT404.
BUK75/76/7E11-55B
TrenchMOS™ standard level FET
10.85
10.60
10.50
7.50
7.40
1.70
8.275
5.40
8.075
0.20
5.08
1.20
1.30
1.55
MSD057
9397 750 12053
Product data
Rev. 02 — 11 November 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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