BUK75150-55A Datasheet, PDF (12/15 Pages) NXP Semiconductors – TrenchMOS standard level FET

Philips Semiconductors
8. Soldering
1.50
2.25 2.15
8.15 ^8.35
1.50
4.60
0.30
4.85
7.95
3.00
solder lands
solder resist
occupied area
solder paste
Dimensions in mm.
Fig 18. Reflow soldering footprint for SOT404.
BUK75/76150-55A
TrenchMOS™ standard level FET
10.85
10.60
10.50
7.50
7.40
1.70
8.275
5.40
8.075
0.20
5.08
1.20
1.30
1.55
MSD057
9397 750 12342
Product data
Rev. 02 — 25 November 2003
© Koninklijke Philips Electronics N.V. 2003. All rights reserved.
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