PMZB1200UPE_15 Datasheet, PDF (11/15 Pages) NXP Semiconductors – 30 V, P-channel Trench MOSFET

NXP Semiconductors
13. Soldering
Footprint information for reflow soldering
PMZB1200UPE
30 V, P-channel Trench MOSFET
1.3
0.7
R0.05 (8x)
SOT883B
0.9
0.25
(2x)
0.3
(2x)
0.3
0.4
(2x)
0.4
solder land
solder land plus solder paste
solder paste deposit
occupied area
solder resist
Dimensions in mm
Fig. 20. Reflow soldering footprint for DFN1006B-3 (SOT883B)
0.6 0.7
sot883b_fr
PMZB1200UPE
Product data sheet
All information provided in this document is subject to legal disclaimers.
25 March 2015
© NXP Semiconductors N.V. 2015. All rights reserved
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