PMXB360ENEA_15 Datasheet, PDF (11/15 Pages) NXP Semiconductors – 80 V, N-channel Trench MOSFET

NXP Semiconductors
13. Soldering
Footprint information for reflow soldering of DFN1010D-3 package
PMXB360ENEA
80 V, N-channel Trench MOSFET
SOT1215
1.2
0.45 (2x)
0.3
1.1
0.35 (2x)
0.25 (2x)
0.4
0.75
0.5
1.5 1.4 0.4
0.5
0.3 0.4
0.5 1.3
0.3 0.4
0.3
0.4
0.5
1.3
solder land
solder land plus solder paste
occupied area
solder resist
Dimensions in mm
Issue date
12-11-23
13-03-06
Fig. 20. Reflow soldering footprint for DFN1010D-3 (SOT1215)
PMXB360ENEA
Product data sheet
All information provided in this document is subject to legal disclaimers.
16 September 2013
sot1215_fr
© NXP N.V. 2013. All rights reserved
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