PSMN0R9-30YLD_15 Datasheet, PDF (10/13 Pages) NXP Semiconductors – N-channel 30 V, 0.87 mΩ logic level MOSFET in LFPAK56 using NextPowerS3 Technology

NXP Semiconductors
PSMN0R9-30YLD
N-channel 30 V, 0.87 mΩ logic level MOSFET in LFPAK56 using
NextPowerS3 Technology
11. Package outline
Plastic single-ended surface-mounted package (LFPAK56); 4 leads
SOT1023
E
A
A
E₁
b₁
c₁
b₂
(3x)
D
H
mounting
base
D₁
L
1
2
3
4
e
b
wA
X
c
A₁ ^C
θ
detail X
L_p
yC
Dimensions
0
2.5
5 mm
scale
Unit
A
A₁
b
b₁ b₂
c
c₁ D⁽¹⁾ D₁₍₁₎ E⁽¹⁾ E₁₍₁₎ e
H
L L_p w
y
θ
max 1.10 0.15 0.50 4.41
0.25 0.30 4.70 4.45 5.30 3.7
6.2 1.3 0.85
8^°
mm nom
0.85
min 0.95 0.00 0.35 3.62
0.19 0.24 4.45
1.27
0.25 0.1
4.95 3.5
5.9 0.8 0.40
0^°
Note
1. Plastic or metal protrusions of 0.15 mm per side are not included.
Outline
References
version
IEC
JEDEC
JEITA
European
projection
SOT1023
Fig. 17. Package outline LFPAK56; Power-SO8 (SOT1023)
sot1023_po
Issue date
11-12-09
13-03-05
PSMN0R9-30YLD
Product data sheet
All information provided in this document is subject to legal disclaimers.
11 November 2014
© NXP Semiconductors N.V. 2014. All rights reserved
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