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PMEG3050EP_15 Datasheet, PDF (10/13 Pages) NXP Semiconductors – 5 A low VF MEGA Schottky barrier rectifier | |||
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NXP Semiconductors
PMEG3050EP
5 A low VF MEGA Schottky barrier rectifier
10. Packing information
Table 8. Packing methods
The indicated -xxx are the last three digits of the 12NC ordering code.[1]
Type number Package Description
PMEG3050EP SOD128 4 mm pitch, 12 mm tape and reel
[1] For further information and the availability of packing methods, see Section 14.
Packing quantity
3 000
-115
11. Soldering
6.2
4.4
4.2
solder lands
3.4 2.5
1.9 2.1
(2Ã) (2Ã)
solder resist
solder paste
occupied area
1.2
(2Ã)
1.4
(2Ã)
Reflow soldering is the only recommended soldering method.
Fig 15. Reflow soldering footprint SOD128
Dimensions in mm
sod128_fr
PMEG3050EP_1
Product data sheet
Rev. 01 â 10 December 2009
© NXP B.V. 2009. All rights reserved.
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