BUK6E4R0-75C_15 Datasheet, PDF (10/14 Pages) NXP Semiconductors – N-channel TrenchMOS FET

NXP Semiconductors
7. Package outline
Plastic single-ended package (I2PAK); low-profile 3-lead TO-262
BUK6E4R0-75C
N-channel TrenchMOS FET
SOT226
D₁
E
D
L₁
b₁
L
123
b
ee
A
A₁
mounting
base
Q
c
0
5
10 mm
scale
DIMENSIONS (mm are the original dimensions)
UNIT A
A₁
b
b₁
c
D
max
D₁
E
e
L
L₁
Q
mm ^{4.5 1.40 0.85 1.3 0.7}
4.1 1.27 0.60 1.0 0.4
11
1.6
1.2
10.3
9.7
2.54
15.0
13.5
3.30
2.79
2.6
2.2
OUTLINE
VERSION
IEC
SOT226
REFERENCES
JEDEC
JEITA
TO-262
EUROPEAN
PROJECTION
Fig 17. Package outline SOT226 (I2PAK)
ISSUE DATE
06-02-14
09-08-25
BUK6E4R0-75C
Product data sheet
All information provided in this document is subject to legal disclaimers.
Rev. 02 — 30 August 2010
© NXP B.V. 2010. All rights reserved.
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