PE3236 Datasheet, PDF (13/15 Pages) Peregrine Semiconductor Corp. – 2200 MHz UltraCMOS-TM Integer-N PLL for Low Phase Noise Applications

PE3236
Product Specification
Handling Requirements
All surface mount products which do not meet
Level 1 moisture sensitivity requirements are
processed through dry bake and pack procedure.
The necessary data is recorded on the caution
label of each shipment. The 44-lead PLCC
package is moisture sensitivity Level 3.
Level 3 Caution Label
The caution label should contain the following
information for Level 3 devices:
1. Calculated shelf life in sealed bag: 12 months
at <40 °C and <90% relative humidity (RH)
2. Peak package body temperature is 225 °C.
3. After bag is opened, devices that will be
subjected to reflow solder or other high
temperature process must
a) Be mounted within 168 hours of factory
conditions <30 °C/60% RH, or
b) Be stored at <10% RH
4. Devices require bake, before mounting, if:
a) Humidity Indicator Card is > 10% when
read at 23 ± 5 °C
b) 3a or 3b are not met
5. If baking is required, devices may be baked for
48 hours at 125 +5/-0 °C
Note: If device containers cannot be subjected to
high temperature or shorter bake times are
desired, reference IPC/JEDEC-J-STD-033 for
bake procedure.
Level and Body temperature defined by:
IPC/JEDEC-J-STD-020
For Dry Bake Procedures, see:
IPC/JEDEC-J-STD-033
Operator must observe ESD precautions per
ESD Control Procedure and Parts Handling and
shipping Procedure.
Document No. 70-0026-03 │ www.psemi.com
©2003-2005 Peregrine Semiconductor Corp. All rights reserved.
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