EXB-V8V-750JV Datasheet, PDF (9/11 Pages) Panasonic Semiconductor – PRODUCT SPECIFICATION FOR APPROVAL

Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Part No.
EXBV8V
14. Tape and Reel Package
14-1. Physical Dimensions
Structure and reel dimensions shall be as shown in the figure below.
Inaccordance with EIAJ ET-7200.
9.0 +/- 1.0
Carrier tape
Spec. No.
151-EXB-V8V01NE
9-8
Top tape
Adhesive tape
14-2. Carrier Tape Dimensions
P0
P2
φD0
11.4 +/- 1.0
Unit : mm
P1
Sprocket hole
T
A
Chip hole
Chip resistor array
(mm)
A
B
W
F
E
1.95±0.15 3.60±0.20 8.00±0.20 3.50±0.05 1.75±0.10
(mm)
P1
P2
P0
T
φD0
4.00±0.10 2.00±0.05 4.00±0.10 0.84±0.05 1.50^+00.10
14-3. Specification
14-3-1. Taping
(1) When the test shall be operated with the below conditions, peel strength should be 0.049N
to 0.49N, should not have flash and tear after peeling.
<Test Method>
Carrier Tape
Peeling Direction
10°
Top Tape
(2) Minimum Bending Radius
When carrier tape shall be bent by minimum bending radius (15 mm), no defection of chip
and no break of carrier tape. However minimum bending radius shall be tested for 1 times.
Panasonic Electronic Devices Co.,Ltd.