EXB-V8V-750JV Datasheet, PDF (4/11 Pages) Panasonic Semiconductor – PRODUCT SPECIFICATION FOR APPROVAL

Subject
Chip Resistor Array PRODUCT SPECIFICATION FOR INFORMATION
Part No.
EXBV8V
Spec. No.
151-EXB-V8V01NE
9-3
As far as there shall be not designation especially, the following test and measurement
shall be operated under normal temperature(15 °C to 35 °C), normal humidity
(25 %RH to 75 %RH), normal atmospheric pressure(86 kPa to 106 kPa).
6. Performance Specification
Item
DC resistance
Specification
Resistor
DC resistance
value shall be
within the
specified
tolerance
Jumper
Less than
50 mΩ
Temperature
coefficient
Resistance
<10Ω
TCR
+600
−100
×10^-6
/
°C
10Ω to 1MΩ ±200×10^-6 / °C
Chip jumper :
Less than 50 mΩ
Overload
±(2 %+0.1 Ω)
Less than
50 mΩ
Intermittent
Overload
Dielectric
Withstanding
Insulation
Resistance
±(5 %+0.1 Ω)
Less than
50 mΩ
No evidence of flashover,
mechanical damage, arcing or
insulation breakdown.
Min. 1,000 MΩ
Test methods
Measuring voltage: refer to JIS-C5201-1
At 20 °C, 65 %RH
Natural resistance change per temperature
degree centigrade.
TCR=
R2 - R1
R1×(t2 - t1)
R1 : Resistance value at reference
temperature(t1)
R2 : Resistance value at test
temperature(t2)
t2 - t1 = 100 °C, t1 = 25 °C
Resistors shall be applied 2.5 times the rated
voltage for 5 seconds.
Maximum over load voltage shall be 100 V.
Resistors shall be subjected to 10000 cycles of
2.5 times the rated voltage applied for 1
second with pause of 25 seconds between
tests.
Maximum over load voltage shall be 100 V
AC 100V between substrate and termination
for 1 minute.
Insulation resistance between substrate and
termination shall be measured at DC 100V.
7. Mechanical characteristic
Item
Bend strength of
the face plating
Solderability
Specification
Resistor
Jumper
Test methods
No mechanical damage
±(1 %+0.05 Ω)
Less than
50 mΩ
Substrate: Glass epoxy(t = 1.6 mm)
Span: 90 mm
Bending distance: 3 mm (10 seconds)
Termination should be
uniformly with solder.
(min. 95 % coverage)
covered
Resistors shall
bath at 235 °C
be
±5
dipped in
°C for 2 s
the melted solder
± 0.5 s. Flux shall
be removed from the surface of termination
with clean organic solvent.
Panasonic Electronic Devices Co.,Ltd.