EYGS1431ZLAA Datasheet, PDF (3/4 Pages) Panasonic Semiconductor – Soft-PGS (Compressible Type) PGS with low thermal resistance

“Soft-PGS (Compressible Type)” PGS with low thermal resistance
● _{PGS in IGBT forms}
Type
Process for IGBT mounting
Sheet only
S Type
Lamination
b
e
Structure
Front
ad
✽
5IJT
TIBQF
JT
BO
FYBNQMF
QMFBTF

DPOUBDU
VT
GPS
EFUBJMFE
TIBQF
PG
FBDI

QBSU
OP
Side
Operating
Temperature Range
Thickness: c
c
−55 to 400 °C
200 Ÿm
No.
Standard
Part No.
a : Lateral size
mm
b : Longitudinal
size
mm
Hole
number
Hole
diameter
0mm
1 EYGS1431ZLAA
140
308
12
6
2 EYGS0925ZLWA
85
246
14
6
3 EYGS1419ZLWB
136
186
8
7.5
4 EYGS0917ZLWC
85
168
10
6
5 EYGS1316ZLAC
125
163
8
6.1
6 EYGS1216ZLWD
120
160
8
6
7 EYGS1116ZLMA
108.8
158
8
6
8 EYGS1315ZLGA
129.5
150
8
7
9 EYGS1314ZLWE
126
136
6
7.5
10 EYGS1014ZLAD
97.8
138
4
6.8
11 EYGS0714ZLAE
70
138
4
5.7
12 EYGS0714ZLAF
69
136
4
7.2
13 EYGS1113ZLMB
106
132
4
5.7
14 EYGS1313ZLGB
128
128
4
6.7
15 EYGS0713ZLAG
66
126
4
5.7
16 EYGS0813ZLMD
71
123
2
4.7
17 EYGS1212ZLGC
120
120
4
5.7
18 EYGS0912ZLGD
88
120
4
5.7
19 EYGS0612ZLWF
60
120
4
5.7
20 EYGS0512ZLGE
53
118
2
5.7
21 EYGS0811ZLGH
80
113
4
5.7
22 EYGS0811ZLWG
78
108
4
6.7
23 EYGS0611ZLWH
60
106
4
6.7
24 EYGS0411ZLWJ
43
105.5
2
5.7
25 EYGS0610ZLAH
59.4
104.4
4
6.7
26 EYGS0410ZLAJ
43
102.8
2
5.7
27 EYGS1010ZLME
98
98
4
6.7
d : Lateral
hole pitch
mm
126
73
124
73
110
110
92.75
118.5
114
86
57
57
95
110
50
Center
110
78
50
Center
70
62
48
Center
48
Center
87
e : Longitudinal
hole pitch
mm
290
234
171
156
150
150
144
137.5
124
127
128
124
121
110
116
116
110
110
110
106
103
93
93
93
93
93
87
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 Mar. 2017