EYGS1431ZLAA Datasheet, PDF (2/4 Pages) Panasonic Semiconductor – Soft-PGS (Compressible Type) PGS with low thermal resistance

“Soft-PGS (Compressible Type)” PGS with low thermal resistance
Typical characteristics
Items
Thickness (Ÿm)
Thermal resistance (K·cm²/W)
Compressibility (%)
Thermal conductivity (W/m·K)
Operating temperature range (°C)
Typical values, not guaranteed.
Test method
TIM Tester
TIM Tester
Laser PIT
Condition
600 kPa
600 kPa
X-Y
Z
Data
200
0.2
40
400 (300 to 600)
(28)
−55 to 400
Thermal resistance and compressibility
2.0
1.8
1.6
1.4
1.2
1.0
0.8
0.6
0.4
0.2
0
0
100 200 300 400 500 600
Pressure (kPa)
60
50
40
30
20
10
0
0 100 200 300 400 500 600 700
Pressure (kPa)
Lamination type/Composition example
● _{Soft-PGS (Compressible Type) standard form}
Type
Process for IGBT mounting
Sheet only
S Type
−
b
Front
a
Structure
Side
c
Operating
Temperature Range
Thickness: c
Standard
Part No.
90 × 90 mm
90 ×180 mm
180 ×180 mm
−55 to 400 °C
200 μm
EYGS0909ZLX2
EYGS0918ZLX2
EYGS1818ZLX2
✽ Part numbers listed above are all standard samples for your consideration.
✽✽ Contact us for custom-made samples.
We can make samples in various forms and/or dimensions other than standard samples.
Design and specifications are each subject to change without notice. Ask factory for the current technical specifications before purchase and/or use.
Should a safety concern arise regarding this product, please be sure to contact us immediately.
03 Mar. 2017