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MN1380 Datasheet, PDF (20/20 Pages) Panasonic Semiconductor – CMOS LSIs for Voltage Detection | |||
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MN1380 Series
Microcomputer Peripheral LSIs
Reliability Testing Results for MN1380 Series
(1) M type package (MN1380/MN13801/MN13802) and TO-92 type package (MN1381/MN13811/MN13812)
Test Subjects
Test Conditions
Results
Operating lifetime test
VDD=5.5V, Ta=125ËC, t=1000hrs
0/15
High-temperature storage test
Ta=150ËC, t=1000hrs
0/15
Low-temperature storage test
Ta=â65ËC, t=1000hrs
0/15
High-temperature,
Ta=85ËC, RH=85%, t=1000hrs
0/15
high-humidity storage test
High-temperature,
VDD=5.5V, Ta=85ËC, RH=85%, t=1000hrs
0/15
high-humidity bias test
Thermal shock test
Ta=150ËC and â65ËC.
0/15
Five minutes at each temperature for ten cycles
Temperature cycle test
Ta=150ËC and â65ËC.
0/15
Thirty minutes at each temperature for ten cycles
Pressure cooker test
Two atmospheres for 50 hours at ambient temperature (Ta) of 121ËC
0/15
Soldering test
Ambient temperature (Ta) of 230ËC for five seconds
0/15
Solder heat resistance test
Ambient temperature (Ta) of 270ËC for ten seconds
0/15
(2) Mini type package (MN1382/MN13821/MN13822)
Test Subjects
Operating lifetime test
High-temperature storage test
Test Conditions
VDD=5.5V, Ta=125ËC, t=1000hrs
Ta=150ËC, t=1000hrs
Results
0/15
0/15
Low-temperature storage test
Ta=â65ËC, t=1000hrs
0/15
High-temperature,
Ta=85ËC, RH=85%, t=1000hrs
0/15
high-humidity storage test
High-temperature,
VDD=5.5V, Ta=85ËC, RH=85%, t=1000hrs
0/15
high-humidity bias test
Thermal shock test
Ta=150ËC and â65ËC.
0/15
Five minutes at each temperature for ten cycles
Temperature cycle test
Ta=150ËC and â65ËC.
0/15
Thirty minutes at each temperature for ten cycles
Pressure cooker test *1
Two atmospheres for 24 hours at ambient temperature (Ta) of 121ËC
0/15
Soldering test
Ambient temperature (Ta) of 230ËC for five seconds
0/15
Solder heat resistance test *1
Ambient temperature (Ta) of 260ËC for five seconds
0/15
Note*1: Note that the testing conditions for the mini package differ from those for the other two packages.
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