MC74HC165A_16 Datasheet, PDF (9/12 Pages) ON Semiconductor – 8-Bit Serial or Parallel-Input/ Serial-Output Shift Register

MC74HC165A
PACKAGE DIMENSIONS
PDIP−16
CASE 648−08
ISSUE U
D
A
16
9
E
H
E1
1
NOTE 8
8
b2
TOP VIEW
e/2
c
B
END VIEW
WITH LEADS CONSTRAINED
NOTE 5
A2
A
NOTE 3
L
A1
D1
C
SEATING
PLANE
M
e
16X b
eB
END VIEW
SIDE VIEW
0.010 M C A M B M
NOTE 6
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: INCHES.
3. DIMENSIONS A, A1 AND L ARE MEASURED WITH THE PACK-
AGE SEATED IN JEDEC SEATING PLANE GAUGE GS−3.
4. DIMENSIONS D, D1 AND E1 DO NOT INCLUDE MOLD FLASH
OR PROTRUSIONS. MOLD FLASH OR PROTRUSIONS ARE
NOT TO EXCEED 0.10 INCH.
5. DIMENSION E IS MEASURED AT A POINT 0.015 BELOW DATUM
PLANE H WITH THE LEADS CONSTRAINED PERPENDICULAR
TO DATUM C.
6. DIMENSION E3 IS MEASURED AT THE LEAD TIPS WITH THE
LEADS UNCONSTRAINED.
7. DATUM PLANE H IS COINCIDENT WITH THE BOTTOM OF THE
LEADS, WHERE THE LEADS EXIT THE BODY.
8. PACKAGE CONTOUR IS OPTIONAL (ROUNDED OR SQUARE
CORNERS).
INCHES
DIM MIN MAX
A −−−− 0.210
A1 0.015 −−−−
A2 0.115 0.195
b 0.014 0.022
b2 0.060 TYP
C 0.008 0.014
D 0.735 0.775
D1 0.005 −−−−
E 0.300 0.325
E1 0.240 0.280
e 0.100 BSC
eB −−−− 0.430
L 0.115 0.150
M −−−− 10 °
MILLIMETERS
MIN MAX
−−− 5.33
0.38 −−−
2.92 4.95
0.35 0.56
1.52 TYP
0.20 0.36
18.67 19.69
0.13 −−−
7.62 8.26
6.10 7.11
2.54 BSC
−−− 10.92
2.92 3.81
−−−
10 °
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