CM1213A_16 Datasheet, PDF (9/12 Pages) ON Semiconductor – 1, 2 and 4-Channel Low Capacitance ESD Protection Array

CM1213A, SZCM1213A
PACKAGE DIMENSIONS
SOT−143
CASE 318A−06
ISSUE U
D
e
A
E1
b1
e1
B
TOP VIEW
A _A1
SIDE VIEW
D
GAUGE
PLANE
E
L2
SEATING
PLANE
L
DETAIL A
3X b
0.20 M C A-B D
c
0.10 C
C
SEATING
PLANE
H
DETAIL A
END VIEW
RECOMMENDED
SOLDERING FOOTPRINT*
NOTES:
1. DIMENSIONING AND TOLERANCING PER ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. MAXIMUM LEAD THICKNESS INCLUDES LEAD FINISH. MINIM­
UM LEAD THICKNESS IS THE MINIMUM THICKNESS OF BASE
MATERIAL.
4. DIMENSIONS D AND E DO NOT INCLUDE MOLD FLASH, PRO­
TRUSIONS, OR GATE BURRS. MOLD FLASH, PROTRUSIONS,
AND GATE BURRS SHALL NOT EXCEED 0.25 PER SIDE.
DIMENSION E1 DOES NOT INCLUDE INTERLEAD FLASH OR
PROTRUSION. INTERLEAD FLASH AND PROTRUSION SHALL
NOT EXCEED 0.25 PER SIDE.
5. DIMENSIONS D AND E1 ARE DETERMINED AT DATUM H.
6. DATUMS A AND B ARE DETERMINED AT DATUM H.
MILLIMETERS
DIM MIN MAX
A 0.80 1.12
A1 0.01 0.15
b 0.30 0.51
b1 0.76 0.94
c 0.08 0.20
D 2.80 3.05
c
E 2.10 2.64
E1 1.20 1.40
e
1.92 BSC
e1
0.20 BSC
L 0.35 0.70
L2
0.25 BSC
1.92
4X
0.75
2.70
0.20
0.96
3X
0.54
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
9