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CM1213A_16 Datasheet, PDF (11/12 Pages) ON Semiconductor – 1, 2 and 4-Channel Low Capacitance ESD Protection Array | |||
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CM1213A, SZCM1213A
PACKAGE DIMENSIONS
SCALE 2:1
D
65 4
HE
12 3
E
b
e
0.05 (0.002)
A
A1
SCâ74
CASE 318Fâ05
ISSUE N
q
C
L
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ANSI Y14.5M, 1982.
2. CONTROLLING DIMENSION: INCH.
3. MAXIMUM LEAD THICKNESS INCLUDES
LEAD FINISH THICKNESS. MINIMUM LEAD
THICKNESS IS THE MINIMUM THICKNESS
OF BASE MATERIAL.
4. 318Fâ01, â02, â03, â04 OBSOLETE. NEW
STANDARD 318Fâ05.
MILLIMETERS
DIM MIN NOM MAX
A 0.90
1.00
1.10
A1 0.01
0.06
0.10
b
0.25
0.37
0.50
c
0.10
0.18
0.26
D 2.90
3.00
3.10
E 1.30
1.50
1.70
e
0.85
0.95
1.05
L
0.20
0.40
0.60
H E 2.50
q
0°
2.75
â
3.00
10°
MIN
0.035
0.001
0.010
0.004
0.114
0.051
0.034
0.008
0.099
0°
INCHES
NOM
0.039
0.002
0.015
0.007
0.118
0.059
0.037
0.016
0.108
â
MAX
0.043
0.004
0.020
0.010
0.122
0.067
0.041
0.024
0.118
10°
SOLDERING FOOTPRINT*
2.4
0.094
1.9
0.074
0.7
0.028
0.95
0.037
0.95
0.037
1.0
0.039
Ç Ç SCALE 10:1
mm
inches
*For additional information on our PbâFree strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
www.onsemi.com
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