NSP8814 Datasheet, PDF (7/7 Pages) ON Semiconductor – Transient Voltage Suppressors

NSP8814, NSP8818
PACKAGE DIMENSIONS
UDFN10 3.5x2, 0.575P
CASE 506CU
ISSUE O
D
PIN ONE
REFERENCE
2X 0.10 C
ÇÇÇÇÇÇÇÇÇ
2X 0.10 C
TOP VIEW
0.05 C
13X
0.05 C
NOTE 4
DETAIL B
SIDE VIEW
AB
E
(A3)
A1
L
L1
DETAIL A
ALTERNATE TERMINAL
CONSTRUCTION
NOTES:
1. DIMENSIONING AND TOLERANCING PER
ASME Y14.5M, 1994.
2. CONTROLLING DIMENSION: MILLIMETERS.
3. DIMENSIONS b APPLIES TO PLATED
TERMINAL AND IS MEASURED BETWEEN
0.15 AND 0.25 MM FROM TERMINAL TIP.
4. COPLANARITY APPLIES TO THE EXPOSED
PAD AS WELL AS THE TERMINALS.
A3
EXPOSED Cu
MOLD CMPD
ÉÉÇÉÉÇ ÉÉÇÉÉÇ _A
A1
C
SEATING
PLANE
DETAIL B
ALTERNATE
CONSTRUCTIONS
MILLIMETERS
DIM MIN MAX
A 0.45 0.55
A1 0.00 0.05
A3 0.127 REF
b 0.15 0.25
D
3.50 BSC
E
2.00 BSC
e
0.575 BSC
e2
0.40 BSC
e3
3.10 BSC
L 0.25 0.35
L1 0.05 0.15
L2 0.95 1.05
e
DETAIL A
1
e3
e2
5
3X L2
10
6
e2
e
BOTTOM VIEW
10X L
13X b
0.10 M
0.05 M
CAB
C NOTE 3
RECOMMENDED
MOUNTING FOOTPRINT*
3.50
2X 0.31
0.40
2X 1.10
8X
0.50
2.30
PACKAGE
OUTLINE
1
6X 0.575
0.40
9X
0.22
DIMENSIONS: MILLIMETERS
*For additional information on our Pb−Free strategy and soldering
details, please download the ON Semiconductor Soldering and
Mounting Techniques Reference Manual, SOLDERRM/D.
MagJack is a trademark of Bel Fuse Inc.
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NSP8814/D